We develop and produce systems for the sustainable and efficient manufacturing of wafers. Our systems are designed to specifically reduce energy and resource consumption without compromising precision and process stability. Through innovative technologies and intelligent process management, we support our customers in building economically successful wafer production while simultaneously taking on ecological responsibility.
Wafer sizes
Processes
Vertical processing system
Vertical rotational spray modules for wafer or substrate pre-cleaning, developing, etching, and stripping. An integrated PLC control system allows for setting customized time and throughput parameters.
Spray development and spray etching systems
The ETCHING CENTER S series equipment are manual spray developing and etching systems for pre-cleaning, developing, etching, and stripping wafers or substrates.
Modular single tank system
The TG program single-tank system with basin volumes of 5 l /10 l / 20 l / 50 l, and 100 l allows for the individual configuration of treatment tanks. Ancillary accessories and anodes enable reliable surface treatment.
Vertical processing system
Vertical rotational spray modules for wafer or substrate pre-cleaning, developing, etching, and stripping. An integrated PLC control system allows for setting customized time and throughput parameters.
Spray development and spray etching systems
The ETCHING CENTER S series equipment are manual spray developing and etching systems for pre-cleaning, developing, etching, and stripping wafers or substrates.
Modular single tank system
The TG program single-tank system with basin volumes of 5 l /10 l / 20 l / 50 l, and 100 l allows for the individual configuration of treatment tanks. Ancillary accessories and anodes enable reliable surface treatment.
We plan, develop and construct manual or automated units according to your individual surface process.
Find out more about our various business areas and systems.
Your contact to us
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