Final surfaces/protective coatings

COMPACTA

endfinishing

For the chemical and electrochemical final surface treatment of printed circuit boards

Manual process control

The COMPACTA series of devices for final surfaces and protective coatings is a universal surface treatment system for protecting PCBs.

Manual

Manual process control

Final surface

Chemical & galvanic

Modular design

Individually expandable

Configurable

Standard designs & special solutions

COMPACTA endfinishing

Final surfaces / protective coatings

Protective coatings - end surfaces

After the etching process, the exposed copper on the circuit board would oxidise and impair the solderability of the components. For this reason, the exposed copper surfaces are coated with a final surface in one of the last production steps.
This protects the copper underneath from oxidation and thus improves the shelf life of the PCB. In addition, the final surface increases the wetability of the connection surfaces during soldering.

The available final surfaces differ in terms of their shelf life, typical areas of application and costs. However, the final surface is usually determined

by subsequent processing steps, the end product or the planned location of the end product.

END SURFACES / PROTECTIVE COATINGS

Process technology

The final surface treatment of the different PCB variants can be integrated into the COMPACTA device series as an additional process step or defined as a stand-alone system for final surfaces.

The special system technology combined with high-quality process chemicals guarantees an optimum surface finish for PCBs.

The system design depends on the respective process steps of the process chemistry:

 

End surface as an integrated system solution

e.g. direct metallization with carbon as catalyst: cleaning - catalysing (carbon) - drying - micro pickling - decapping - copper plating - final surface / protective layer - various rinsing units

 

Final surface as a single unit

e.g. chemical nickel/gold: cleaning – activation – chemical nickel – chemical gold – various rinsing units   

PROCESS

Cleaner (optional)
Pedestal/spray sink
Activator
Electroless nickel
Chemical gold
Pedestal sink
Flow sink
VE sink

Available accessories and optional conversions

  • Additional basin
  • Drip tray
  • Extraction hood
  • Goods movement
  • Chemicals
  • Circuit board holder (de-energized)
  • Ion exchanger systems for rinsing
  • Foot switch for spray sink
  • Changing the pool size
    according to the required
    work surface

Plate holder

Universal plate holder (multiple)

for de-energized applications

Universal plate holder

for de-energized applications

Universal plate holder

for de-energized applications

Goods movement

END SURFACE TREATMENT OF PCBs

End surfaces / protective coatings

COMPACTA additional basin for chemical and electrochemical end surfaces

COMPACTA additional tanks for chemical separations
Systems for special applications

Additional basin versions

Pre-treatment

  • PP or PVC basin
  • Ball drain valve
  • Movement arm
  • Cover

  • Electroless surfaces

  • PP basin
  • Thermally insulated
  • Radiator with thermostat
  • Ball drain valve
  • Movement arm
  • Cover

  • Galvanic surfaces

  • PP basin
  • Thermally insulated
  • Radiator with thermostat
  • Ball drain valve
  • Movement arm
  • Cover

  • Hot sink

  • PP basin
  • Thermally insulated
  • Radiator with thermostat
  • Ball drain valve
  • Movement arm
  • Cover

  • SPECIAL EQUIPMENT

    Possible system variants

    FURTHER SYSTEMS

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