Through hole plated technology

For the galvanic through-hole plating process, we offer our COMPACTA series. It serves as a universally applicable electroplating system for the chemical or galvanic deposition of metals in vertical technology. In consultation with the customer, the equipment is individually adapted according to the required process steps. Using graphite as a catalyst, the standard process is based on the environmentally friendly direct metallisation according to the tenting or subtractive process.

COMPACTA MD Through hole plated technology