VERTIKALe DURCHLAUFANLAGE

CONVERT

2300 & 2400

Zur Herstellung von Leiterplatten,
Formätzteilen oder SMD Schablonen

Vertical process control for consistent results

Der CONVERT 2300 & 2400 bietet Ihnen eine All-In-One Lösung im Bereich der Leiterplattenherstellung. Mit seinem vertikalen Durchlaufprinzip und dem Rotationssprühsystem erzielen Sie gleichmäßige Ergebnisse. Die integrierte SPS-Steuerung ermöglicht die Automatisierung des gesamten Prozesses. 

PLC

Automatic process control

Rotary spray system

For even results

Vertical process control

Double-sided processing

Dryer

For direct further processing

ALL.
IN.
ONE.

CONVERT

Areas of application

GUIDANCE PANELS
WAFER
FORMATS

GUIDANCE PANELS

Developing | Etching | Stripping

of single and double-sided printed circuit boards

WAFER & SUBSTRATE

Developing | Etching | Stripping

from wafers

FORMATS

Developing | Mold etching | Stripping

of stainless steel & non-ferrous metals & precious metals

TAILORED TO YOUR PROCESS

Vertical process control

The vertical flow principle in combination with the rotary spray system results in a very uniform development and etching rate over the entire working area. The transport speed, temperature control and pump control are individually controlled with the integrated PLC control. The integrated multiple rinsing technology achieves a high rinsing effect with low water consumption. The roller transport system in the treatment chambers enables the processing of different panel thicknesses. The appliance is also characterized by easy filling and emptying of the system, dry-running protection for pumps and heating elements. 

Das Schleusensystem dichtet die einzelnen Kammern voneinander ab. Alle medienberührten Teile sind aus chemikalienbeständigem Kunststoff oder Titan.

Advanced electroplating systems

Process technology

The blank is automatically and evenly transported through the etching, developer & stripper chamber and rinsing units. A sealless magnetically coupled centrifugal pump conveys the temperature-controlled solution to the rotating spray arms. The rotating spray system distributes the solutions evenly on the board. The blanks or substrates are pre-rinsed in the subsequent rinsing units. Final cleaning with fresh water takes place in the second rinsing chamber. The multiple rinsing technology minimizes rinsing water consumption.

TAILORED TO YOUR PROCESS

System structure

Complete solution

Spray developer
+ Spüleinheit

Spray developer with circuit and
Fresh water sink,
Titanium sheathed radiators

Spray etcher
+ Spüleinheit

Spray etcher with circuit and
Fresh water sink,
Titanium sheathed radiators

Spray stripper
+ Spüleinheit

with circulation and fresh water sink,
Stripping module with additional storage tank,
Stainless steel strainer insert and filter unit

Dryer
(optional)

ROTATIONSSPRÜHSYSTEM

Consistent results.

System advantages
  • Uniform and fast processing of the blank
  • Newly developed airlock system
  • Minimal carry-over losses
  • Compact, space-saving design
  • Multiple flush technology (recirculation and fresh water flush) 
Rotation
spray system

Uniform & single or double-sided processing

Low water consumption

Environmentally friendly & cost-efficient thanks to multi-rinse technology

SPS-
controlled

Automatic process control & transport
speed

Our  Rotary spray systems result in a particularly uniform and intensive treatment of the entire surface. The units are equipped with multiple rinses and are characterized by their clean and compact operation. Thanks to their modular design, the units can be extended with a continuous dryer.

AUTOMATISIERUNG

PLC-controlled systems

The PLC controls the most important functions of the system depending on the throughput speed.

Die Platine wird automatisch durch die Ätz-/ Entwicklungskammer und die Spüleinheiten transportiert. Der Start der Bewegung erfolgt durch Auslösen der Lichtschranke am Einlauf der Maschine.
The built-in control unit regulates the following functions:

  • An-/ Ausschalten der Pumpe des Prozesstanks
  • An-/ Ausschalten der Pumpe der Kreislaufspüle
  • An-/Ausschalten des Elektromagnetventils der Frischwasserspüle.
  • Control of the transport speed

The process time in the etching or developing chamber can be continuously adjusted on the touch panel. The flushing duration can also be changed depending on the maximum speed.

AUTOMATISIERUNG

Einfache Prozessüberwachung
dank visueller Darstellung.

Bath temperature
Metering
Circulation
Process visualization
Movement
Bath analysis
Rack manager
Protocol
Bath temperature
Metering
Rack manager
Process visualization
Bath analysis
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Unsere Inhouse programmierte SPS für die Galvanotechnik ermöglicht Ihnen eine präzise und zuverlässige Steuerung Ihrer galvanischen Prozesse. Das Interface kann individuell auf Ihre Bedürfnisse angepasst werden. Mit der Integration modernster SPS-Technologie optimieren wir Ihre Produktionsabläufe und gewährleisten eine hohe Qualität und Effizienz bei jedem Prozessschritt.

MODULAR STRUCTURE

With our modules
cover the entire process.

Spray developing
Spray etching
Spray strips

MODULAR STRUCTURE

Modules in detail

SPECIAL EQUIPMENT

Possible system variants

WEITERE ANLAGEN

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Tanja Lemmen

Marketing & Sales