VERTICAL CONTINUOUS FLOW SYSTEM

Convert

2300 & 2400

For the production of printed circuit boards,
mold etched parts or SMD stencils

Vertical process control for consistent results

The Convert 2300 & 2400 offers you an all-in-one solution for PCB production. With its vertical throughfeed principle and rotary spray system, you can achieve consistent results. The integrated PLC control enables automation of the entire process. 

PLC

Automatic process control

Rotary spray system

For even results

Vertical process control

Double-sided processing

Dryer

For direct further processing

ALL.
IN.
ONE.

CONVERT

Areas of application

GUIDANCE PANELS
WAFER
FORMATS

GUIDANCE PANELS

Developing | Etching | Stripping

of single and double-sided printed circuit boards

WAFER & SUBSTRATE

Developing | Etching | Stripping

from wafers

FORMATS

Developing | Mold etching | Stripping

of stainless steel & non-ferrous metals & precious metals

TAILORED TO YOUR PROCESS

Vertical process control

The vertical flow principle in combination with the rotary spray system results in a very uniform development and etching rate over the entire working area. The transport speed, temperature control and pump control are individually controlled with the integrated PLC control. The integrated multiple rinsing technology achieves a high rinsing effect with low water consumption. The roller transport system in the treatment chambers enables the processing of different panel thicknesses. The appliance is also characterized by easy filling and emptying of the system, dry-running protection for pumps and heating elements. 

The airlock system seals the individual chambers from each other. All parts in contact with the medium are made of chemical-resistant plastic or titanium.

Advanced electroplating systems

Process technology

The blank is automatically and evenly transported through the etching, developer & stripper chamber and rinsing units. A sealless magnetically coupled centrifugal pump conveys the temperature-controlled solution to the rotating spray arms. The rotating spray system distributes the solutions evenly on the board. The blanks or substrates are pre-rinsed in the subsequent rinsing units. Final cleaning with fresh water takes place in the second rinsing chamber. The multiple rinsing technology minimizes rinsing water consumption.

TAILORED TO YOUR PROCESS

System structure

Complete solution

Spray developer
+ flushing unit

Spray developer with circuit and
Fresh water sink,
Titanium sheathed radiators

Spray etcher
+ flushing unit

Spray etcher with circuit and
Fresh water sink,
Titanium sheathed radiators

Spray stripper
+ flushing unit

with circulation and fresh water sink,
Stripping module with additional storage tank,
Stainless steel strainer insert and filter unit

Dryer
(optional)

Rotary spray system

Consistent results.

System advantages
  • Uniform and fast processing of the blank
  • Newly developed airlock system
  • Minimal carry-over losses
  • Compact, space-saving design
  • Multiple flush technology (recirculation and fresh water flush) 
Rotation
spray system

Uniform & single or double-sided processing

Low water consumption

Environmentally friendly & cost-efficient thanks to multi-rinse technology

SPS-
controlled

Automatic process control & transport
speed

Our  Rotary spray systems result in a particularly uniform and intensive treatment of the entire surface. The units are equipped with multiple rinses and are characterized by their clean and compact operation. Thanks to their modular design, the units can be extended with a continuous dryer.

MODULAR STRUCTURE

With our modules
cover the entire process.

Spray developing
Spray etching
Spray strips

Modules in detail

SPECIAL EQUIPMENT

Possible system variants

Automation

PLC-controlled systems

The PLC controls the most important functions of the system depending on the throughput speed.

The blank is automatically transported through the etching/development chamber and the rinsing units. The movement is started by triggering the light barrier at the right inlet of the machine.
The built-in control unit regulates the following functions:

  • Switching the pump on/off Process tank
  • Switching the pump on/off Circuit flush
  • Switching the fresh water sink solenoid valve on/off.
  • Control of the transport speed

The process time in the etching or developing chamber can be continuously adjusted on the touch panel. The flushing duration can also be changed depending on the maximum speed.

Further attachments

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Please contact us using our inquiry form or give us a call.

Do you have any questions?

Please contact us using our inquiry form or give us a call.

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MEDICAL TECHNOLOGY

Manual electroplating systems

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Tanja Lemmen

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