The vertical pass-through process ensures fast, residue-free drying of PCBs, mold etched parts or other substrates. The PCB is automatically transported through the drying zones. The throughput speed is infinitely adjustable. Specially mounted rollers ensure uniform throughput even with different board thicknesses.

The wet blanks or substrates are pre-dried in a preliminary stage (squeeze zone) and then pass through the hot air drying process. The cross-flow fans with heating register generate a uniform laminar air flow across the entire working width. This ensures optimum drying of the surface and drill holes.

Thanks to the high dryer output and fast throughput time, the materials to be processed are quickly available for the subsequent processing steps. The newly developed vertical throughput principle offers the user maximum quality and user-friendliness.